Performance Polymers — The Only Indian Manufacturer Delivering Liquid RTV-2 Part Silicone at Scale 100% Made in India MoldSil™ — Trusted Silicone Brand Industry-Leading RTV-2 Silicone Solutions Tin Cure Silicone Solutions Platinum Cure Silicone Solutions High-Performance Silicone Additives Precision Mold Making Materials Consistent Quality & Reliable Supply Engineered for Industrial Applications MoldSil™ — A Trademark of Performance Polymers Advanced Silicone Technology from India Designed for Accuracy, Strength & Durability Supporting Mold Makers & Industries Worldwide Trusted by Professionals Across Industries High Precision RTV-2 Silicone Systems Built for Performance & Long-Term Stability Innovation in Every Batch

SilGel

SilGel - E65

Soft Silicone Gel for Electronic Potting Applications

SILGEL-E65 is a two part addition cure type Silicone Gel used for Electrical and Electronic potting application. The two low viscosity liquid silicone components when mixed together cure to form very soft, gel-like elastomer.

This product has been specifically developed for easy mix ratio of 1:1 of two components (Part A and Part B). These gels are stable over a wide temperature range. The adhesion of these gels to various substrates makes them suitable for various applications in electrical/electronic industry.

Product Features:

  • Low viscosity - Free of solvents - Easy for mixing manually or in an automated mix-meter equipment
  • Room Temperature Cure with easy Mix Ratio of 1:1
  • Excellent Thermal oxidation resistance
  • Excellent Dielectric properties
  • Low volatility and low shrinkage
  • Chemically inert
  • Optical clarity allows visual inspections
  • Self-healing behavoiur
  • Outstanding mechanical and thermal stress protection
  • Vibration dampening
  • Primer-less adhesion- tacky to many substrates/surfaces
Image

Technical Overview

Color - Part A:Transparent
Color - Part B:Blue
Technical Datasheet
Property Standard Units Value
Viscosity PART A @25°C mPa.s
Brookfield Spindle:2 Speed : 30 rpm 		500
Viscosity PART B @25°C mPa.s
Brookfield Spindle:2 Speed : 30 rpm 		500
Mix Ratio - - A:B = 1:1
Cure Time @25°C - Hrs 2-3
Density @25°C - g/cm3 0.98
Thermal Conductivity - W/m.K 0.19
Coefficient of Thermal Expansion - cm/cm °C 27 x 105
Flash Point - °C >290
Pour Point - °C -50
Refractive Index @25°C - nd25 1.40
Water Content - Ppm <100
Pot Life @25°C Min 20-30
Gel Hardness - Grams 115-120

Usable Life and Storage

The warranty period is 9 months from date of shipment if stored in the original unopened container at ambient temperature of less than 27oC.

Moldsil
Make In india
Go To Top